PRECISION SMT & PCBA
MANUFACTURING
Precision in-house SMT & through-hole assembly in Hyderabad. Powered by automated DEK solder printing, tandem Fuji Aimex III C placement, and 100% in-line AOI verification — engineered for zero-defect reliability from quick-turn prototypes to volume production.
Tandem Fuji Aimex III C (H24 rotary + H08 precision heads)
Every production assembly verified post-reflow
Handling down to 0201 passives and 0.3mm ball pitch
In-house SMT + THT in Hyderabad with zero outsourcing dependencies
Comprehensive Electronics Assembly Services
From automated DEK solder printing to dual Fuji pick-and-place lines and AOI inspection, we deliver production-grade electronics.
Surface Mount Technology (SMT) Assembly
High-speed dual-line placement with micron accuracy
Our core in-house SMT line features DEK Horizon 03iX stencil printing and two Fuji Aimex III C pick-and-place systems (H24 rotary + H08 precision heads), delivering flawless placement of 0201 passives, dense BGAs, and fine-pitch QFNs.
- High-density double-sided SMT placement
- Fine-pitch 0.3mm BGA & CSP handling
- Lead-free (RoHS) and leaded soldering chemistries
Through-Hole (THT) Assembly
Rugged mechanical and high-power component integration
Specialized through-hole mounting for power supplies, relays, robust connectors, and discrete switches. Executed by trained technicians with full barrel-fill inspection.
- Precision component lead forming and staging
- Temperature-calibrated ESD hand soldering
- Mechanical hardware and heatsink installation
Precision Stencil Printing
Automated DEK solder paste deposition with optical alignment
The foundation of reliable solder joints starts at solder paste printing. Our DEK platform ensures micron-level repeatable registration and uniform paste transfer efficiency.
- Dual vision camera fiducial alignment
- Programmable squeegee speed & pressure profiling
- Automated stencil underside cleaning cycles
Controlled Thermal Reflow
Engineered multi-zone thermal curves with zero hot-spots
Multi-zone convection reflow profiling tailored to substrate thermal mass. Guarantees uniform wetting without thermal shock to delicate semiconductors.
- Substrate-specific thermocouple profiling
- Gentle pre-heat ramp preventing solder spatter
- Controlled liquidus dwell time for optimum intermetallic formation
Automated Optical Inspection (AOI)
100% board scanning eliminating manual inspection escapes
In-line optical inspection scanning every component placement and solder fillet against CAD models to detect bridges, misalignments, and tombstoning immediately.
- 100% post-reflow inspection coverage
- Automated polarity and component text OCR verification
- Solder fillet height and wetting angle analysis
Component & PCB Baking (MSD)
IPC J-STD-033 moisture mitigation for ultra-reliable electronics
Moisture degasification for sensitive IC packages and bare printed boards prior to soldering, eliminating delamination, blistering, and popcorning defects.
- Controlled low-temperature dry baking cycles
- Floor life management for MSL 2a through MSL 5a packages
- Pre-assembly circuit board desiccation
Interactive Production Line
Follow our board assembly sequence from automated solder paste application to dual pick-and-place mounting, thermal reflow, and 100% AOI inspection.
DEK Horizon 03iX Stencil Printer
High-repeatability automatic stencil printing applying precise solder paste volumes with automated dual-camera optical fiducial alignment and closed-loop squeegee pressure control.
Real Production Equipment
Explore our machine-by-machine assembly tooling. Zero simulated or outsourced line machinery.
SMT Line Intelligence & MES IN-HOUSEFUJI NEXIM Programming Suite
Station 1: Centralized SMT production execution and machine programming software suite controlling our Fuji Aimex III C line.
Solder Paste Printing IN-HOUSEDEK Horizon 03iX Precision Stencil Printer
Flagship automated SMT stencil printer equipped with HawkEye 750 digital vision, Cyclone under-stencil cleaning, and ±12.5µm @ 6-sigma alignment.
High-Speed SMT Placement IN-HOUSEFuji Aimex III C — Unit 1 (H24 Rotary Head)
Equipped with the 24-nozzle rotary H24 head dedicated to rapid micro-passive and standard chip placement up to 40,000 CPH.
Fine-Pitch & IC Placement IN-HOUSEFuji Aimex III C — Unit 2 (H08 Precision Head)
Equipped with the 8-nozzle H08 multi-function head for fine-pitch BGAs, CSPs, micro-QFNs, and odd-form components.
Thermal Soldering IN-HOUSEMulti-Zone Convection Reflow Oven
Multi-zone forced-air convection reflow oven ensuring uniform heat transfer and tight thermal profiles.
Vision Quality Assurance IN-HOUSEIn-line Automated Optical Inspection (AOI)
Automated vision inspection system capturing multi-angle high-resolution images of every solder joint.
Moisture-Sensitive Device Handling IN-HOUSEComponent & Substrate Baking Chambers
Controlled dry baking ovens for moisture degasification in accordance with J-STD-033.
THT Assembly IN-HOUSEManual & Semi-Automated Through-Hole Assembly
Dedicated through-hole assembly line with lead forming, precision hand-soldering, and mechanical assembly.
FUJI NEXIM Programming Suite
LogiQ's dual Aimex III C lines are powered and synchronized by NEXIM—the industry gold-standard manufacturing execution software. NEXIM optimizes placement sequences offline, verifies feeder barcodes to prevent incorrect component loading, and simulates 3D nozzle travel before a single board enters the line.
NEXIM Line Balancing & Cycle Time Simulator
Simulate how our tandem Fuji Aimex III C line balances your board architecture.
Engineered for Hardware Reliability
Built to serve hardware startups, electronics OEMs, and scaling product enterprises who require tight tolerance and transparent execution.
In-House Precision Without Outsourcing
From DEK Horizon 03iX stencil printing and dual Fuji Aimex pick-and-place machines to AOI and baking, your designs are produced under one roof in Hyderabad with direct engineering oversight.
100% Automated Optical Inspection
We do not rely on sample checks. Every single production board passes through in-line AOI to catch solder bridges, tombstoning, and polarity offsets before it moves forward.
Strict Moisture-Sensitive Handling
We implement documented component baking protocols in line with J-STD-033, preventing internal delamination and micro-voiding in high-density BGAs and multi-layer boards.
Agile Turnaround: Prototypes to Medium Batches
Configured for hardware startups, engineering pilot runs, and scaling OEMs who demand rapid feeder changeovers, transparent DFM feedback, and accountable schedules.
Transparent DFM & Engineering Support
Our manufacturing team reviews your Gerber files, BOM, and centroid coordinates before firing up the line, ensuring aperture optimization and high first-pass yield.
Strategic Hyderabad Location
Situated at the heart of India's premier aerospace, defense, and electronics manufacturing corridor with direct logistical access to airports and freight carriers.
Automated Optical Inspection & Quality Verification
100% inspection coverage. Every circuit board runs through high-resolution telecentric optical analysis post-reflow.
100% Joint Verification
Automated detection of solder bridging, insufficient wetting, component tombstoning, and polarity rotation before boards leave the line.
J-STD-033 MSD Baking
Controlled thermal desiccation for moisture-sensitive ICs and bare PCBs, eliminating internal delamination and micro-cracking defects.
Secondary Stereo Microscope QC
IPC-A-610 trained quality inspectors carry out high-magnification verification on fine-pitch connectors and mechanical terminations.
Industries We Manufacture For
Custom assembly processes configured for demanding thermal, vibration, and compact form-factor requirements.
IoT & Smart Devices
Ultra-compact sensor nodes, BLE/cellular telemetry, wearable electronics.
LED Lighting & Drivers
High-power MCPCB arrays, intelligent dimmers, commercial luminaires.
Automotive Electronics
Telematics, EV battery management boards (BMS), cluster displays.
Industrial Automation & Power
PLC modules, motor controllers, sensor interfaces, ruggedized gateways.
Consumer Hardware
Smart home appliances, acoustic modules, handheld measurement tools.
Aerospace & Defense Sub-assemblies
Rugged communications, power regulation modules, high-reliability boards.
Engineered Trust with Hardware Teams
Placeholder customer feedback representing typical OEM engagement results.
“LogiQ's tandem Fuji Aimex SMT line placed our 0201 passives and 0.4mm pitch BGAs with zero rework on a 200-unit pilot run. Their Hyderabad team caught a footprint mismatch in DFM before stencils were cut.”
“Finding an SMT partner who actually runs 100% in-line AOI and proper component baking for small-to-medium batches changed our yield dramatically from 88% to 99.4%.”
“The speed of setup and responsiveness from LogiQ's engineering desk allowed us to deliver functional prototypes to our enterprise clients two weeks ahead of schedule.”
Ready to Run Your SMT Assembly at LogiQ?
Upload your Gerber files and bill of materials. Our engineering desk in Hyderabad will deliver an itemized quote and DFM feedback within 24 hours.