Step-by-Step Production Workflow
Explore how your bare PCB and raw bill-of-materials travel through our Hyderabad SMT facility, with tight process controls at every junction.
SMT Line Step Progression
DEK Horizon 03iX Stencil Printer
High-repeatability automatic stencil printing applying precise solder paste volumes with automated dual-camera optical fiducial alignment and closed-loop squeegee pressure control.
Yield Protection at Every Stage
We design out defects early. Here is how each station prevents escapes and guarantees solder joint integrity.
DEK Horizon 03iX Stencil Printer
High-repeatability automatic stencil printing applying precise solder paste volumes with automated dual-camera optical fiducial alignment and closed-loop squeegee pressure control.
Fuji Aimex III C (H24 Rotary Head)
First-stage high-speed component population utilizing the 24-nozzle rotary H24 head. Handles micro-passives (0201 to 24mm chip packages) at up to 40,000 CPH with continuous on-the-fly vision centering.
Fuji Aimex III C (H08 Multi-Function Head)
Second-stage placement configured with the 8-nozzle H08 precision head for high-density ICs, BGAs, CSPs, QFNs, connectors, and complex odd-form components.
Multi-Zone Convection Reflow Oven
Precise thermal ramp and multi-zone heating profile ensuring optimal solder paste wetting, minimal thermal stress, and zero voiding.
In-line AOI Machine
100% automated optical inspection of every soldered joint, verifying component presence, orientation, polarity, solder fillets, and bridge detection.
Stereo Microscope QC Stations
Manual secondary verification by trained quality technicians using high-magnification optical microscopes to validate cosmetic and mechanical integrity.
Need DFM Feedback on Your Gerber & Stencil Design?
Our manufacturing team will review your solder paste apertures and component spacing for zero-defect production.