In-House SMT Line & Equipment
Deep-dive into our in-house machine assets in Hyderabad. Every system is calibrated for high repeatable precision, zero thermal voiding, and 100% optical quality inspection.
FUJI NEXIM Programming Suite
Station 1: Centralized SMT production execution and machine programming software suite controlling our Fuji Aimex III C line.
NEXIM serves as the operational brain of LogiQ's SMT line. Before a board is printed or populated, NEXIM imports CAD/BOM coordinates, calculates Multi-Job Line Balancing (MJLB) between the tandem Aimex III C units, performs virtual 3D collision simulations, and verifies feeder reel barcodes (DID) to guarantee 100% component placement integrity.
DEK Horizon 03iX Precision Stencil Printer
Flagship automated SMT stencil printer equipped with HawkEye 750 digital vision, Cyclone under-stencil cleaning, and ±12.5µm @ 6-sigma alignment.
The DEK Horizon 03iX provides sub-0.3mm aperture paste release accuracy with >2.0 Cpk @ ±12.5µm machine repeatability. Features closed-loop motorized squeegee pressure (0–20 kg), digital HawkEye 750 optical fiducial alignment, and the high-speed Cyclone under-stencil cleaner (programmable wet/dry/vacuum cycles). Controlled via DEK Instinctiv™ software with full-color TFT display on an ergonomic swivel arm.
Fuji Aimex III C — Unit 1 (H24 Rotary Head)
Equipped with the 24-nozzle rotary H24 head dedicated to rapid micro-passive and standard chip placement up to 40,000 CPH.
Engineered for high-throughput assembly, Unit 1 utilizes the 24-nozzle H24 rotary turret head with on-the-fly digital vision centering and servo-driven gantry positioning. Mounts 0201 to 24mm chip packages with zero mechanical vibration. Fully programmed via Fuji NEXIM software for optimized nozzle path trajectory and DID feeder verification.
Fuji Aimex III C — Unit 2 (H08 Precision Head)
Equipped with the 8-nozzle H08 multi-function head for fine-pitch BGAs, CSPs, micro-QFNs, and odd-form components.
Unit 2 acts as the high-precision IC placement engine in our tandem line, outfitted with the 8-nozzle H08 precision head. Programmed via NEXIM for 3D component shape recognition, lead coplanarity verification, ball pitch validation, and programmable Z-axis placement pressure down to 0.3mm fine pitch.
Multi-Zone Convection Reflow Oven
Multi-zone forced-air convection reflow oven ensuring uniform heat transfer and tight thermal profiles.
Equipped with independent top and bottom temperature regulation across multiple heating and cooling zones. Allows custom reflow profiling tailored to dense multi-layer boards, aluminum-core substrates, and sensitive sensors.
In-line Automated Optical Inspection (AOI)
Automated vision inspection system capturing multi-angle high-resolution images of every solder joint.
Our AOI platform scans 100% of manufactured boards post-reflow. Advanced defect recognition algorithms evaluate fillet geometry, detect solder bridges, check component markings and polarity, and flag tombstoning or missing components.
Component & Substrate Baking Chambers
Controlled dry baking ovens for moisture degasification in accordance with J-STD-033.
Prevents the risk of 'popcorning', internal delamination, and solder joint micro-cracking during reflow. All moisture-sensitive devices (MSD level 2 through 5a) and bare circuit boards undergo validated dry-baking cycles prior to line introduction.
Manual & Semi-Automated Through-Hole Assembly
Dedicated through-hole assembly line with lead forming, precision hand-soldering, and mechanical assembly.
For connectors, power transformers, electrolytic capacitors, and high-mechanical-stress components. Handled by IPC-trained assembly technicians at ESD-protected workstations with temperature-controlled soldering irons.
Interactive SMT Line Balancer & Estimator
Test how Fuji NEXIM Multi-Job Line Balancing (MJLB) dynamically balances passives and fine-pitch ICs across our tandem Aimex III C line.
NEXIM Line Balancing & Cycle Time Simulator
Simulate how our tandem Fuji Aimex III C line balances your board architecture.
Schedule a Line Walkthrough or Request a Quote
Our Hyderabad plant welcomes engineering audits. Submit your BOM and Gerber files to start production planning.