High-speed dual-line placement with micron accuracy

Our core in-house SMT line features DEK Horizon 03iX stencil printing and two Fuji Aimex III C pick-and-place systems (H24 rotary + H08 precision heads), delivering flawless placement of 0201 passives, dense BGAs, and fine-pitch QFNs.

Rugged mechanical and high-power component integration

Specialized through-hole mounting for power supplies, relays, robust connectors, and discrete switches. Executed by trained technicians with full barrel-fill inspection.

Automated DEK solder paste deposition with optical alignment

The foundation of reliable solder joints starts at solder paste printing. Our DEK platform ensures micron-level repeatable registration and uniform paste transfer efficiency.

Engineered multi-zone thermal curves with zero hot-spots

Multi-zone convection reflow profiling tailored to substrate thermal mass. Guarantees uniform wetting without thermal shock to delicate semiconductors.

100% board scanning eliminating manual inspection escapes

In-line optical inspection scanning every component placement and solder fillet against CAD models to detect bridges, misalignments, and tombstoning immediately.

IPC J-STD-033 moisture mitigation for ultra-reliable electronics

Moisture degasification for sensitive IC packages and bare printed boards prior to soldering, eliminating delamination, blistering, and popcorning defects.